WGDicing GmbH
Experts in dicing, die sorting and inspecting
For over 20 years, Wafer & Glassubstrate Dicing GmbH & Co. KG has been providing high-precision sawing services. Many customers are from the semiconductor and optical industries. The renowned wafer manufacturers appreciate our special know-how when it comes to meeting particularly demanding requirements during sawing, finding smart solutions to quality problems or managing peak loads. For many small and medium-sized companies, WGDicing GmbH is a competent service partner for the high-precision and customised separation of various materials such as semiconductors, glass, technical ceramics or printed circuit boards.
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Contact
How to reach us
Wafer & Glassubstrate Dicing GmbH & Co. KG
Gewerbepark Birkenhain 2663589 Linsengericht, Germany
Phone: +49 (0) 6051 91678-0
Fax: +49 (0) 6051 91678-20
Sometimes the difference is made by how we do things
WGDicing GmbH is a medium-sized and family-run company. Reliability and flexibility are our hallmarks. Decisions are made in a non-bureaucratic manner and quickly. This refers to the handling of requests for new materials, unusual formats or customer-specific delivery forms. We deal with them in an open and solution-oriented way. Urgent inquiries are managed in the same way. When things need to be done fast, we pull out all the stops instead of giving in. As a result, it is sometimes possible to realise what initially seemed impossible.
Services
Our service range at a glance
WGDicing GmbH
Member of the Rhein-Main Microsystems Technology Network
mst-Netzwerk Rhein-Main e.V. is an initiative of manufacturers, users and suppliers of microsystems technology as well as a number of outstanding research institutions and universities in the Rhein-Main region. Our aim is to promote microsystems technology in the region, to intensify joint research and to strengthen the transfer of knowledge from science to industry.
